Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications by Qu, Shichun; Liu, Yong

Springer-Verlag Publishing, 2014. 1. Hardcover. Very Good. Very Good+; Hardcover; Covers are still glossy; Unblemished textblock edges; The endpapers and all text pages are bright and unmarked; The binding is tight with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.4 lbs; Red covers with title in white lettering; 2014, Springer-Verlag Publishing; 339 pages; "Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications," by Shichun Qu & Yong Liu.

Springer-Verlag Publishing, 2014. 1. Hardcover. Like New. Fine/As New; Hardcover; Covers are still glossy with "sharp" edge-corners; Unblemished textblock edges; The endpapers and text pages are all bright and unmarked; The binding is tight with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); 1.4 lbs; Dark red covers with title in white lettering; 2014, Springer-Verlag Publishing; 339 pages; "Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications," by Shichun Qu & Yong Liu.

hardcover. Good. Access codes and supplements are not guaranteed with used items. May be an ex-library book.

Hard Cover. New. New Book; Fast Shipping from UK; Not signed; Not First Edition; The Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications.

Springer, 2014. Hardcover. New. 322 pages. 9.25x6.25x1.00 inches.