Home Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines � A Focus on Reliability by Michael Pecht - 1994

Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines � A Focus on Reliability by Michael Pecht - 1994

Name: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines
Price: 57.00 CAD
Availability: InStock
Author: Pecht, Michael
ISBN: 9780471594468

by Michael Pecht

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Integrated Circuit, Hybrid, and Multichip Module P Package Design Guidelines � A Focus on Reliability

by Michael Pecht

New
Hardcover

Wiley-Interscience, 1994. Hardcover. New. second printing edition. 426 pages. 9.75x6.50x1.25 inches.

Bookseller Revaluation Books (GB)
Format/Binding Hardcover
Book Condition New New
Quantity Available 1
Binding Hardcover
ISBN 10 0471594466
ISBN 13 9780471594468
Publisher Wiley-Interscience
Date Published 1994

We have 4 copies available starting at €38.73.

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines

by Pecht, Michael

Used
near fine
Hardcover
first

Condition

Used - Near Fine

Jacket Condition

Near Fine

Edition

First Edition, Second Printing

Binding

Hardcover

ISBN 10 / ISBN 13

9780471594468 / 0471594466

Quantity Available

Seller

Harropian Books, IOBA

Nelson, British Columbia, Canada

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Item Price

€38.73

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Description:

New York: Wiley-Interscience, 1994. First Edition, Second Printing. Hardcover. Near Fine/Near Fine. Blue cloth over boards with title stamped in orange onto upper board and spine, 8vo, pp. xxxi, 426, illustrated with charts, tables and diagrams. Clean and unmarked throughout with light wear to jacket.